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CY2510ZXC-1T | Cypress Semiconductor

CY2510ZXC-1T

Status: Obsolete

CY2510ZXC-1T

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)40
Input Signal TypeLVCMOS/LVTTL
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs11
No. of PLL1
Output Frequency Max. (MHz)140
Output Frequency Min. (MHz)40
Output Signal TypeLVCMOS/LVTTL
Spread SpectrumY
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.09 $1.76 $1.57 $1.38 $1.30 $1.22
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
24
Package Dimensions
312 L x 1 H x 173 W (Mils)
Package Weight
92.26 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Product Change Notice (PCN) (9)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

Product Termination Notice (PTN) (1)

Feb 04, 2016
July 2014 Product Obsolescence Notification

IBIS (1)

Mar 02, 2010