CY24271ZXCT | Cypress Semiconductor


Status: In Production


(pdf, 1.69 MB) RoHS PB Free
Datasheet updated: June 24, 2016


Core Voltage (V)2.5
I/O Voltage (V)2.5
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)100
Input Signal TypeRef-in differential
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)2.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)2.38
No. of Outputs4
No. of PLL1
Output Frequency Max. (MHz)800
Output Frequency Min. (MHz)300
Output Signal TypeDifferential
Spread SpectrumN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.41 $2.87 $2.56 $2.25 $2.12 $1.98
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
388 L x 1 H x 173 W (Mils)
Package Weight
105.14 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (12)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of Cypress Manufacturing Limited (CML), Philippines as Alternative Assembly Site for TSSOP28L Package
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

IBIS (1)

Mar 16, 2012