CY23FP12OXC | Cypress Semiconductor

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CY23FP12OXC
Status: In Production

Datasheet

(pdf, 450.4 KB) RoHS PB Free

CY23FP12OXC

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)200
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.13
No. of Outputs12
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread SpectrumN
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.01 $8.42 $7.51 $6.60 $6.23 $5.82
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
94
Minimum Order Quantity (MOQ)
94
Order Increment
94
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (2)

Software and Drivers (1)

Feb 11, 2011

Product Change Notice (PCN) (12)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
Feb 08, 2016
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the FailSafe Clock Product Family

Advanced Product Change Notice (APCN) (1)

Oct 30, 2017
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Feb 05, 2016
Second Errata for Prune/EOL/Obsolete PCN 071503

IBIS (1)

Jan 06, 2010