CY2304NZZXC-1 | Cypress Semiconductor

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CY2304NZZXC-1
Status: In Production

Datasheet

(pdf, 783.41 KB) RoHS PB Free

CY2304NZZXC-1

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)140
Input Frequency Min. (MHz)0
Input Signal TypeLVCMOS/LVTTL
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs4
No. of PLL0
Output Frequency Max. (MHz)140
Output Frequency Min. (MHz)0
Output Signal TypeLVCMOS
Spread SpectrumN
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.44 $3.74 $3.33 $2.93 $2.77 $2.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 220 24-48 hours

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
176 L x 1 H x 173 W (Mils)
Package Weight
21.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
324
Minimum Order Quantity (MOQ)
324
Order Increment
324
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 16, 2016

Technical Documents

Product Change Notice (PCN) (11)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
Feb 08, 2016
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly

Product Information Notice (PIN) (2)

Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
Changes to Cypress Address Labels

IBIS (2)

Sep 13, 2010
May 21, 2010