CY2303SXC | Cypress Semiconductor
CY2303SXC
| Automotive Qualified | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 41.67 |
| Input Frequency Min. (MHz) | 10 |
| Input Signal Type | LVCMOS/LVTTL |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Outputs | 3 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 166.67 |
| Output Frequency Min. (MHz) | 10 |
| Output Signal Type | LVCMOS |
| Spread Spectrum | N |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.30 | $6.14 | $5.48 | $4.81 | $4.55 | $4.25 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
194
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Package Material Declaration
Last Update: Sep 28, 2017
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
Last Update: Nov 10, 2016
Last Update: Nov 10, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Dec 22, 2015
Technical Documents
Product Change Notice (PCN) (17)
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 17, 2017
Qualification of TSMC as an alternate wafer fabrication site for the Zero Delay Buffer General Purpose Clocks Family
Oct 16, 2017
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)