CY2291FXT | Cypress Semiconductor

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CY2291FXT
Status: NRND: Contact Sales

Datasheet

(pdf, 150.3 KB) RoHS PB Free

CY2291FXT

Automotive QualifiedN
Core Voltage (V)3.3/5.0
I/O Voltage (V)3.3/5.0
Input Frequency Max. (MHz)30
Input Frequency Min. (MHz)1
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs8
No. of PLL3
Output Frequency Max. (MHz)90
Output Frequency Min. (MHz)0.077
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.00 $3.37 $3.00 $2.64 $2.49 $2.33
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
20
Package Dimensions
505 L x 0 H x 300 W (Mils)
Package Weight
550.00 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Feb 11, 2011

Product Change Notice (PCN) (9)

Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
Oct 13, 2017
Add Alternate Assembly Site for SOIC300mils Pb-Free.
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report
Oct 19, 2011
Qualification of Taiwan Semiconductor Manufacturing Corporation (TSMC) as a new Wafer Foundry Site for the CY2291 and CY2292 product families

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor

Product Information Notice (PIN) (3)

Feb 05, 2016
Design Marginality issue with CPLL of CY2291/CY2292 device family (Three-PLL General Purpose EPROM Programmable Clock Generator)
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

Product Termination Notice (PTN) (1)

Sep 19, 2017

IBIS (1)

Apr 12, 2012