CY2291FX | Cypress Semiconductor

CY2291FX
Status: In Production

Datasheet

(pdf, 1.47 MB) RoHS PB Free

CY2291FX

Automotive QualifiedN
Core Voltage (V)3.3/5.0
I/O Voltage (V)3.3/5.0
Input Frequency Max. (MHz)30
Input Frequency Min. (MHz)1
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs8
No. of PLL3
Output Frequency Max. (MHz)90
Output Frequency Min. (MHz)0.077
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.00 $3.37 $3.00 $2.64 $2.49 $2.33
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
20
Package Dimensions
505 L x 0 H x 300 W (Mils)
Package Weight
550.00 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
370
Minimum Order Quantity (MOQ)
370
Order Increment
370
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Feb 11, 2011

Product Change Notice (PCN) (13)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Add Alternate Assembly Site for SOIC300mils Pb-Free.
Feb 10, 2016
Add Alternate Assembly Site for SOIC150mils Pb-Free
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report
Oct 19, 2011
Qualification of Taiwan Semiconductor Manufacturing Corporation (TSMC) as a new Wafer Foundry Site for the CY2291 and CY2292 product families

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor

Product Information Notice (PIN) (2)

Feb 05, 2016
Design Marginality issue with CPLL of CY2291/CY2292 device family (Three-PLL General Purpose EPROM Programmable Clock Generator)
Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)

Apr 12, 2012