CY223811FXI | Cypress Semiconductor

CY223811FXI
Status: In Production

Datasheet

(pdf, 395.15 KB) RoHS PB Free
(pdf, 361.27 KB) RoHS PB Free
(pdf, 427.76 KB) RoHS PB Free

CY223811FXI

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)150
Input Frequency Min. (MHz)1
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.13
No. of Outputs3
No. of PLL3
Output Frequency Max. (MHz)166
Output Frequency Min. (MHz)0
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.84 $4.07 $3.63 $3.19 $3.01 $2.82
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
194
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Feb 11, 2011

Product Change Notice (PCN) (8)

Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

IBIS (1)

Feb 11, 2010