CY2077FSXC | Cypress Semiconductor

CY2077FSXC
Status: In Production

Datasheet

(pdf, 328.6 KB) RoHS PB Free

CY2077FSXC

Automotive QualifiedN
Core Voltage (V)3.3/5.0
I/O Voltage (V)3.3/5.0
Input Frequency Max. (MHz)75
Input Frequency Min. (MHz)1
Input Signal TypeXtal/LVCMOS/LVTTL
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Outputs1
No. of PLL1
Output Frequency Max. (MHz)133
Output Frequency Min. (MHz)0.39
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$22.90 $18.89 $17.52 $16.03 $15.34 $14.66
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
194
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
91
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Feb 11, 2011

Product Change Notice (PCN) (12)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 09, 2016
Qualification of TSMC for the High Accuracy EPROM
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)

Feb 05, 2010