CY14B108N-BA45XI | Cypress Semiconductor
CY14B108N-BA45XI
| Automotive Qualified | N |
| Density (Kb) | 8192 |
| Frequency (MHz) | N/A |
| Interface | Parallel |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 2.70 |
| Min. Operating Voltage (V) | 2.70 |
| Organization (X x Y) | 512Kb x 16 |
| Part Family | Parallel nvSRAM |
| Speed (ns) | 45 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $52.14 | $46.25 | $43.45 | $40.64 | $38.40 | $35.88 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| In Stock | 250 | 24-48 hours | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
299
Minimum Order Quantity (MOQ)
299
Order Increment
299
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Feb 22, 2018
IPC 1752 Material Declaration
Last Update: Oct 21, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 20, 2016
Technical Documents
Application Notes (10)
Feb 18, 2018
Product Change Notice (PCN) (5)
Oct 25, 2017
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages
Product Information Notice (PIN) (2)
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families