CY14B108M-ZSP25XI | Cypress Semiconductor

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CY14B108M-ZSP25XI
Status: In Production

Datasheet

(pdf, 1.08 MB) RoHS PB Free
(pdf, 156.52 KB) RoHS PB Free
(pdf, 1.2 MB) RoHS PB Free

CY14B108M-ZSP25XI

AlarmsY
AlarmsY
Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)512Kb x 16
Part FamilyParallel nvSRAM
RTCY
RTCY
Speed (ns)25
Tape & ReelN
Temp. ClassificationIndustrial
Watchdog TimerY
Watchdog TimerY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$63.97 $56.74 $53.30 $49.87 $47.11 $44.02
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
54
Package Dimensions
878 L x 1.2 H x 400 W (Mils)
Package Weight
580.02 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
108
Minimum Order Quantity (MOQ)
108
Order Increment
108
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (6)

Oct 12, 2017
Sep 18, 2017
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels

Product Errata Notice (PEN) (1)

Feb 04, 2016
Errata for Autostore Disable Feature on 8 Mb nvSRAMDevices

Verilog (1)

Jul 26, 2010

VHDL (1)

Apr 19, 2010

IBIS (2)

Nov 30, 2009