CY14B104LA-BA25XIT | Cypress Semiconductor

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CY14B104LA-BA25XIT
Status: In Production

Datasheet

(pdf, 910.24 KB) RoHS PB Free

CY14B104LA-BA25XIT

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)512Kb x 8
Part FamilyParallel nvSRAM
Speed (ns)25
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$30.93 $27.44 $25.78 $24.11 $22.78 $21.29
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (9)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of New Die Attach Epoxy and New Substrate Design for Select 48 Ball Grid Array (BGA) Packages
Oct 24, 2017
Qualification of Cypress Philippines as an Additional Assembly Site for select 48BGA products
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 12, 2017
PCN162502
Oct 11, 2017
Sep 18, 2017

Product Information Notice (PIN) (3)

Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Verilog (1)

Mar 14, 2011

VHDL (1)

IBIS (1)