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Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION 676 - FBGA (27 x 27 x 1.6 mm) (BB676) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 54-VFBGA (8 x 8 mm) (BV54) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 48-VFBGA (6 X 8 mm) (BV48) BKK SnPb CuPd WIRE
IPC1752 MATERIAL DECLARATION 48-VFBGA (6 X 8 mm) (BV48) ASET SnPb CuPd WIRE
IPC1752 MATERIAL DECLARATION 48-VFBGA (6 X 8 mm) (BV48) ASET SnPb Au WIRE
IPC 1752 Material Declaration WLCSP 42 (FN42A) 2.63x3.18x0.55 mm_Decatech_SnAgCu
IPC1752 MATERIAL DECLARATION 48-VFBGA (8 X 9.5 mm) (BV48) PT Unisem Batam SnPb Au WIRE Non Pb free
IPC1752 MATERIAL DECLARATION 48-VFBGA (8 X 9.5 mm) (BV48) ASET SnPb Cu WIRE Non Pb free
IPC1752 MATERIAL DECLARATION 48-TFBGA (8 X 9.5 mm) (BA48) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 48-TFBGA (7 X 8.5 mm) (BA48) ASET SnPb Au WIRE Using Halogen-free Substrate
IPC1752 MATERIAL DECLARATION 48-TFBGA (7 X 8.5 mm) (BA48) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 48-TFBGA (8 X 20 mm) (BA48) ASET SnPb Au WIRE
IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN
IPC1752 MATERIAL DECLARATION PBGA 292 (27 x 27 mm) (BG292)_ASET_SnPb_Au Wire Non Pb-free
IPC1752 MATERIAL DECLARATION HSBGA 272 (27x27x2.38 mm) (BH272)_ASET_SnPb_Au Wire Non Pb-Free
IPC1752 MATERIAL DECLARATION PBGA 272 (27 x27 mm) (BG272)_ASET_SnPb_Au Wire Non Pb-free
IPC1752 MATERIAL DECLARATION FBGA 36 (7X8.5X1.2MM) (BA36)_ASET_SnPb_CuPd Wire Non Pb-free
IPC1752 MATERIAL DECLARATION FBGA 36 (7X8.5X1.2MM) (BA36)_ASET_SnPb_Au Wire Non Pb-free
IPC1752 MATERIAL DECLARATION L2BGA 304 (31x31x1.57mm) (BL304)_ASET_SnPb_Au Wire - Non Pb Free
IPC1752 MATERIAL DECLARATION FBGA 288 (19x19x 1.7 mm) (BB288)_ASET_Au Wire Non Pb-free
IPC1752 MATERIAL DECLARATION PDIP 28L (600 MILs) (PZ28)_Amkor Phils _Pure Sn_Cu WIRE
IPC1752 MATERIAL DECLARATION 504 - L2BGA (37x37.5mm) (BL504) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 96-FBGA (6X6X1.0 MM) (BZ/R2A96) BKK SnAgCU Au WIRE
IPC1752 MATERIAL DECLARATION 48-TFBGA (8 X 10 mm) (BA48) ASET SnPb Au WIRE
IPC1752 MATERIAL DECLARATION 48-FBGA (8 x 9.5 x 1.0 mm) (BZ48) CML SnAgCu CUPD WIRE
IPC1752 MATERIAL DECLARATION 48-FBGA (8 x 9.5 x 1.0 mm) (BZ48) CML SnAgCu AU WIRE
IPC1752 MATERIAL DECLARATION 48-FBGA (8 x 9.5 x 1.0 mm) (BZ48) ASET SnAgCu CUPD WIRE
IPC1752 MATERIAL DECLARATION 48-FBGA (8 x 9.5 x 1.0 mm) (BZ48) ASET SnAgCu CU WIRE
IPC1752 MATERIAL DECLARATION 56 - BGA ( 5 x 5 mm ) (BZ56) CML SnAgCu CuPd WIRE
IPC1752 MATERIAL DECLARATION 56 - BGA ( 5 x 5 mm ) (BZ56) CML SnAgCu Au WIRE
IPC1752 MATERIAL DECLARATION 56 - BGA ( 5 x 5 mm ) (BZ56) ASET SnAgCu CuPd WIRE
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product. IPC1752 MATERIAL DECLARATION 84- BGA (6 x 6 x 1mm) (BZ84) CML SnAgCu Au WIRE
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_CML_SnAgCu_CuPd WIRE_ATB120 Film_GR9810 Mold Compound
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_Cypress Bangkok_SnAgCu_CuPd WIRE
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_CML_SnAgCu_CuPd WIRE
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_PT UNISEM_SnAgCu_Au WIRE
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_ASET_SnAgCu_Au WIRE_Film Adhesive_G1250 Mold Compound
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_ASET_SnAgCu_CuPd WIRE
IPC1752 MATERIAL DECLARATION FBGA 165 (13 x 15 mm) (BW165)_ASET_SnAgCu_Cu WIRE
IPC1752 MATERIAL DECLARATION 388 FCFBGA (35X35 MM) (FG388) Amkor Korea (K4) SnPb
IPC1752 MATERIAL DECLARATION 48-TFBGA (6 X 10 mm) (BA48) ASET CUPD WIRE
IPC1752 MATERIAL DECLARATION 48-TFBGA (6 X 10 mm) (BA48) ASET AU WIRE Using Halogen-free Substrate
IPC1752 MATERIAL DECLARATION 48-TFBGA (6 X 10 mm) (BA48) ASET AU WIRE
IPC1752 MATERIAL DECLARATION 484-FBGA (23x23mm) (BB48) ASET AU Ion Impurities WIRE Stacked Die using DAF die attach
IPC1752 MATERIAL DECLARATION 484-FBGA (23x23mm) (BB48) ASET AU Ion Impurities WIRE
IPC1752 MATERIAL DECLARATION 36 TBGA (7X7 MM) (BA36) ASET SnPb CuPd Wire
IPC1752 MATERIAL DECLARATION 36 TBGA (7X7 MM) (BA36) ASET SnPb Au Wire
IPC1752 MATERIAL DECLARATION 36 TBGA (7X7 MM) (BA36) ASET SnPb Au Wire Using Standard Molding Compound
IPC1752 MATERIAL DECLARATION FBGA 256 (17 x17 mm) (BB256)_ASET_SnPb_CuPd Wire
IPC1752 MATERIAL DECLARATION FBGA 256 (17 x17 mm) (BB256)_ASET_SnPb_Au Wire

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