Spansion(R) Presents at electronica 2008 in Munich, Germany | Cypress Semiconductor
Spansion(R) Presents at electronica 2008 in Munich, Germany
SUNNYVALE, Calif., Nov 10, 2008 -- Spansion(R) Inc. (Nasdaq: SPSN), the world's largest pure-play provider of Flash memory solutions, will present at electronica 2008 Automotive and Wireless Forums on November 11th and November 14th.
During the Automotive Forum, Roberto Cotti, director of Business Development for Spansion's Security and Advanced Technology Division (SATD), will discuss how the Spansion "managed NAND" product family will simplify system level design to complement industry-standard chipsets and microcontrollers. In addition, he will highlight how the products are paving the path for future integration of data management on a single chip.
Spansion will also present during the Automotive Forum where Peter Heinrich, senior manager of Automotive Marketing for Spansion's Consumer, Set-Top Box and Industrial Division, will describe the convergence of automotive and industrial applications using Flash memory. Peter will also discuss how Flash memory platforms such as parallel NOR, SPI and serial NAND address multiple segments, and the architectures that are most efficient for diverse embedded designs.
In addition, Peter will discuss the functional makeup of mobile devices and future trends in wireless markets while considering the direction of optimal memory subsystems. He will also analyze the criteria required by mobile phone systems and services from the perspective of interfaces, transfer speed and memory capacity.
Spansion is exhibiting at electronica 2008 in booth # 121 in hall A5 where the company will present trends and Flash memory needs in the automotive market. Spansion will also be presenting its full in-line Flash memory solutions for wireless, automotive, networking, consumer electronics, and industrial markets.
electronica 2008, which will be held in Munich from November 11th to November 14th, is one of the world's leading electronic trade shows. The event targets designers and developers of applications oriented around electronic circuitry. Products from the following industrial sectors will be on display: electronic engineering, electronics, distributors, telecommunication, engineering, etc. The product range includes microchip products, boards/subsystems, discrete semiconductor components, electro-mechanical components, etc.
Automotive Forum Who: Roberto Cotti, director of Business Development for Spansion's Security and Advanced Technology Division What: Presenting "The path for future integration and data management on a single chip: Spansion managed SLC MirrorBit(R) ORNAND2(TM)" When: Tuesday November 11th from 14:30 to 15:00 Where: Hall A6 Automotive Forum Who: Peter Heinrich, senior manager of Automotive Marketing for Spansion's Consumer, Set-Top Box and Industrial Division What: Presenting "The Convergence of Automotive and Industrial Applications using Flash Memory" When: Tuesday November 14th from 12:30 to 13:00 Where: Hall A6 Wireless Forum Who: Peter Heinrich, senior manager of Automotive Marketing for Spansion's Consumer, Set-Top Box and Industrial Division. What: Presenting "Worldwide Trends of Next Generation Mobile Phone Platforms and Role of High Performance Memory Sub Systems" When: Tuesday November 11th from 15:00 to 15:30 Where: Hall A4
electronica 2008 will take place at the new Munich trade faire center: Messe Muenchen GmbH - Messegelaende in Munich, Germany. Please visit Spansion's booth at: 121 Hall 5.
Spansion (Nasdaq: SPSN - News) is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing, selling and licensing Flash memory solutions. For more information, visit http://www.spansion.com.
Spansion(R), the Spansion Logo(R), MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), ORNAND2(TM), HD-SIM(TM), Spansion(R) EcoRAM(TM) and combinations thereof, are trademarks of Spansion LLC. Spansion, the Spansion Logo and MirrorBit are registered in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.