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Spansion Presenting Flash Memory Talks at 2008 Denali MemCon in Santa Clara | Cypress Semiconductor

Spansion Presenting Flash Memory Talks at 2008 Denali MemCon in Santa Clara

Last Updated: July 21, 2008

SUNNYVALE, Calif., July 21, 2008 -- Spansion Inc., helps kick off MemCon with two executive presentations focusing on data center energy consumption and charge-trapping technology trends. MemCon is the largest worldwide conference addressing business, technology, and system design strategies for semiconductor memory and storage.

    Who:   Dan Byers, vice president of Worldwide Field Engineering &
           Corporate Strategic Marketing and John Nation, director of
           Corporate Marketing at Spansion.

    What:  Byers will present, "The Future of Flash Memory: Floating-Gate
           Technology, Charge Trapping Technology and Beyond."  Hear Byers
           discuss the advantages of Spansion's charge trapping technology and
           the promises and challenges of new, alternative technologies.

           Nation will be giving a presentation titled, "The Road Ahead for
           NOR Flash Memory Applications." Learn how Spansion(R) EcoRAM(TM)
           cuts data center power consumption by replacing DRAM with Flash
           memory and how it has the potential to propel NOR into a new space.

    When:  John Nation: Tuesday, July 22, 11:00 - 11:30 am, PST.
           Dan Byers: Wednesday, July 23, 1:00 - 1:30 pm, PST.

    Where: Hyatt Regency Santa Clara
           Denali MemCon 2008 (


Spansion (Nasdaq: SPSN) is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit

Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), ORNAND2(TM), HD-SIM(TM), Spansion(R) EcoRAM(TM) and combinations thereof, are trademarks of Spansion LLC in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.