Spansion to Present at Lehman Brothers Wireless and Wireline Conference | Cypress Semiconductor
Spansion to Present at Lehman Brothers Wireless and Wireline Conference
SUNNYVALE, Calif., May 29, 2007 --
Who: Dario Sacomani, EVP and Chief Financial Officer
When: Thursday, May 31, 2007 at 4:00 pm ET, 1:00 pm PT.
Where: Interested parties may access the live presentation, and the
replay of the presentation for 30 days thereafter, over the
Internet at the investor relations section of the company's
website at http://www.spansion.com.
Spansion is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit http://www.spansion.com.
Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), HD-SIM(TM) and combinations thereof, are trademarks of Spansion LLC. Spansion, the Spansion logo and MirrorBit are registered trademarks in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.