Spansion to Present at 2007 Bank of America Credit Conference | Cypress Semiconductor
Spansion to Present at 2007 Bank of America Credit Conference
SUNNYVALE, Calif., Nov 29, 2007 --
Who: Mark Mohler, Corporate Treasurer and Bob Okunski, Director of Investor Relations. When: Monday, December 3, 2007 at 11:10 a.m., Eastern Time, 8:10 a.m. Pacific Time. Where: Interested parties may access the conference call live and 30 days thereafter through the investor relations section of the company's website at http://www.spansion.com.
Spansion is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit http://www.spansion.com.
Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), ORNAND 2(TM), HD-SIM(TM) and combinations thereof, are trademarks of Spansion LLC in the U.S. and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.