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Spansion Launches 128Mb MirrorBit(R) SPI Flash Memory with Industry-Leading 104MHz Performance | Cypress Semiconductor

Spansion Launches 128Mb MirrorBit(R) SPI Flash Memory with Industry-Leading 104MHz Performance

Last Updated: April 09, 2007

Addition to SPI portfolio combines reliability, performance and density requirements for set-top boxes, networking, printers and other consumer, enterprise and infrastructure applications

SUNNYVALE, Calif., April 9, 2007 -- Spansion Inc. (Nasdaq: SPSN), the world's largest pure-play provider of Flash memory solutions, today announced the industry's highest performing 128Mb Serial Peripheral Interface (SPI) Flash Memory device. Produced on 90nm MirrorBit(R) technology, the 128Mb MirrorBit SPI device can help manufacturers take advantage of the lower overall system costs that SPI provides while offering the high performance and reliability that higher density applications demand. Spansion also has SPI products in mass production from 4Mb through 64 Mb today.

At 104MHz, the 128Mb MirrorBit SPI device brings Serial Flash performance to a new level, making it an ideal choice for applications such as high-end printers, FPGAs, networking equipment and set-top boxes by giving manufacturers the speed and performance they need to compete in the industry while helping them manage their costs. Spansion is currently sampling the 128Mb MirrorBit SPI device to customers, with production slated to begin in the second quarter of 2007.

"Spansion's goal is to help our customers innovate and bring their ideas to market as quickly as possible," said Sylvia Summers, executive vice president of Spansion's Consumer, Smart Card and Industrial Division. "With the 128Mb MirrorBit SPI solution, manufacturers can take advantage of the design capabilities and system cost benefits of high-performance, high-density SPI Flash memory and tap into new market opportunities."

The 128Mb MirrorBit SPI device maintains packages with consistent pinouts -- the Universal Footprint -- that allow users to migrate from lower to higher density serial Flash memory without having to alter board layouts. The Universal Footprint gives manufacturers the efficiency to develop solutions based on a single platform and leverage their hardware and software designs across multiple product lines, quickening their time-to-market with innovative solutions. Spansion also offers an x8 Parallel mode to speed up factory programming throughput and lower costs. The 128Mb MirrorBit SPI solution part number is S25FL128P, and is available in industry-standard 16-pin SOIC as well as WSON 6x8 packages with EU RoHS compliance* and the option of standard materials.

The new 128Mb S25FL128P device is the latest member of the MirrorBit SPI FL family, which also includes products from 4Mb through 64Mb. All devices are based on Spansion's two-bit-per-cell MirrorBit technology and feature fast read speeds of 50MHz (104MHz for the 128Mb) for faster boot times on embedded products.

The 128Mb device is backwards compatible with 16-64Mb devices due to its industry-standard 16-pin SOIC and WSON 6x8 packages, command sets and pinouts to help ensure plug-and-play compatibility with existing designs. The 4Mb and 8Mb SPI devices are available in 8-pin SOIC and 8-contact USON packaging options. The 16Mb is offered in 8-pin and 16-pin SOIC packages and an 8- contact WSON package.

Spansion is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit

* EU RoHS -- The European Union Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2004 ("the EU RoHS Regulations"). To be EU RoHS compliant, a maximum concentration value not greater than 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and not greater than 0.01% by weight in homogenous materials for cadmium will be permitted in the manufacture of new EEE (Electrical and Electronic Equipment).

NOTE: Spansion(R), the Spansion Logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), HD-SIM(TM) and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.