Spansion Inc. Announces Webcasts at Upcoming Conferences | Cypress Semiconductor
Spansion Inc. Announces Webcasts at Upcoming Conferences
SUNNYVALE, Calif., April 30, 2013 -- Spansion Inc. (NYSE: CODE), a leading innovator of Flash memory solutions, today announced that it will webcast its presentations at the following upcoming conferences:
- Jefferies Global TMT Conference on Tuesday, May 7, 2013, at 3:30pm ET in New York, NY.
- Barclays High Yield Bond and Syndicated Loan Conference on Wednesday, May 22, 2013, at 8:10am CT in Chicago, IL.
- Barclays Global Technology, Media and Telecommunications Conference on Thursday, May 23, 2013, at 11:25am ET in New York, NY.
The presentations will be available live via webcast and archived on the Investor Relations section of the company's website http://investor.spansion.com under Events and Presentations.
Spansion (NYSE: CODE) is a leading provider of the Flash memory technology at the heart of the world's electronics systems, powering everything from the routers that run the internet to the highly interactive and immersive consumer and automotive electronics that are enriching people's daily lives. Spansion's broad and differentiated Flash memory product portfolio, award-winning MirrorBit charge-trapping technology, and industry leading service and support are enabling customers to achieve greater efficiency and success in their target markets. For more information, visit http://www.spansion.com.
Spansion®, the Spansion logo, MirrorBit®, and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.