Spansion Inc. Announces Participation in Upcoming Conferences | Cypress Semiconductor
Spansion Inc. Announces Participation in Upcoming Conferences
SUNNYVALE, Calif., May 1, 2014 -- Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, today announced that it will webcast its presentations at the following upcoming conferences:
- Jefferies 2014 Technology, Media and Telecom Conference on Thursday, May 8, 2014, at 11:30am ET in Miami, FL.
- Wedbush Securities 2014 Technology Conference on Tuesday, May 13, 2014, at 10:20am ET in New York, NY.
- Barclays High Yield Bond and Syndicated Loan Conference on Wednesday, May 14, 2014, at 9:30am MT in Phoenix, AZ.
The presentations will be available live via webcast and archived on the Investor Relations section of the company's website http://investor.spansion.com under Events and Presentations.
Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion's Flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http://www.spansion.com.
Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owner.