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Spansion and Qimonda Sign Strategic Supply Agreement to Deliver Optimized Memory Subsystems for Mobile Customers | Cypress Semiconductor

Spansion and Qimonda Sign Strategic Supply Agreement to Deliver Optimized Memory Subsystems for Mobile Customers

Last Updated: April 11, 2007

SUNNYVALE, Calif. and MUNICH, Germany, April 11, 2007-- Spansion Inc. (NASDAQ, SPSN), the world's largest pure-play provider of Flash memory solutions, and Qimonda, a leading DRAM manufacturer, today announced that the companies have signed a strategic supply agreement that will combine Qimonda low-power specialty DRAM with Spansion® MirrorBit® NOR and ORNAND devices into Multi-Chip Packages (MCP) memory solutions for mobile devices. The companies plan to align product roadmaps, in particular providing Qimonda PSRAM (Pseudo SRAM) devices specified for certain Spansion Flash memory, which is expected to result in improved yields and cost-effective solutions that can bring more efficiency to handset OEMS.

Under the terms of the agreement, Qimonda will provide Spansion with its low-power Cellular-RAM (PSRAM) and Mobile-RAM devices in Known Good Die (KGD) form, which Spansion will use in MCP solutions. The term KGD means that Qimonda performs all functional and quality testing of the dies on the finished wafer, which are then stacked with Spansion Flash memory in a compact MCP.

"Working with Qimonda demonstrates our commitment to deliver value-added memory subsystem solutions that will bring efficiency to our customers," said Sudesh Bhikha, vice president of business operations, Wireless Solutions Division at Spansion. "We have strategically selected companies such as Qimonda that will optimize DRAM for our Flash memory solutions to provide a seamless experience for our customers and enable them to more quickly and cost-effectively introduce innovative handsets."

"This strategic supply agreement creates a powerful combination between a world-leading manufacturer of Flash memory solutions and Qimonda's proven, ultra-low- power product families," said Ayad Abul-Ella, vice president and general manager of the Mobile and Consumer Business Unit at Qimonda. "By delivering KGDs for assembly in a variety of total densities and interfaces, we are contributing to the development of a compelling family of MCP devices for the mobile market."

Qimonda CellularRAM is a pseudo-SRAM (PSRAM) device that provides high-density, high-bandwidth and power-efficient memory solutions at a very attractive cost/bit ratio compared to conventional SRAM. Mobile-RAM products are an ultra-low-power DRAM, which can reduce power consumption by up to 80 percent compared to equivalent density standard SDRAM. When combined with Spansion MirrorBit NOR and ORNAND Flash memory, the MCP solutions address the fast-growing memory demand in space-constrained mobile handsets.

MCP solutions with 64Mb and 128Mb CellularRAM are already available from Spansion and are shipping in mass production. Products featuring higher storage densities and products based on Double Data Rate (DDR) Mobile-RAM are planned for later in 2007. For more detailed information for any of these products, customers can contact their local Spansion representative.

About Spansion

Spansion is a leading Flash memory solutions provider, dedicated to enabling, storing and protecting digital content in wireless, automotive, networking and consumer electronics applications. Spansion, previously a joint venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to designing, developing, manufacturing, marketing and selling Flash memory solutions. For more information, visit

About Qimonda

Qimonda AG is a leading supplier of DRAM memory products. Following its carve out from Infineon Technologies AG on May 1, 2006, Qimonda went public on the New York Stock Exchange on August 9, 2006. The company generated net sales of €3.81 billion in its 2006 financial year and has approximately 12,000 employees worldwide. Qimonda has access to five 300mm manufacturing sites on three continents and operates five major R&D facilities, including its lead R&D center in Dresden. The company is a leading supplier of DRAM products to PC and server manufacturers and is increasingly using its power saving trench technology for graphics, mobile and consumer applications. Further information is available at

Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse, ORNAND, HD-SIM and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

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