Spansion and Macronix Reach Settlement Agreement | Cypress Semiconductor
Spansion and Macronix Reach Settlement Agreement
Agreement Ends Litigation Between the Companies Worldwide
SUNNYVALE, Calif. and HSINCHU, Taiwan, Jan. 27, 2015 -- Spansion Inc. (NYSE: CODE), a worldwide leader in non-volatile memory and embedded systems solutions, and Macronix International Co., Ltd. (TSE: 2337), a global leader in non-volatile memory semiconductor solutions, today announced the companies have settled all outstanding patent disputes and actions, including their respective complaints at the US International Trade Commission as well as District Court, inter partes review proceedings at USPTO, and Macronix's patent infringement complaint against Spansion in Germany. As part of the settlement, both companies agreed to dismiss all patent cases between them and their downstream customers worldwide.
In the agreement, the companies have granted certain rights under the disputed patents to each other. The settlement allows both companies to direct their full attention and resources to continuing to innovate and serving their customers' needs as leaders in the memory semiconductor industry.
Other terms of the settlement agreement, including financial terms, were not disclosed.
Macronix, a leading integrated device manufacturer in the Non-Volatile Memory (NVM) market, provides a full range of NOR Flash, NAND Flash, and ROM products. With its world-class R&D and manufacturing capability, Macronix continues to deliver high-quality, innovative and performance driven products to its customers in the consumer, communication, computing, automotive, networking and other segment markets.
For more information, please visit the Macronix's website: www.macronix.com
Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http://www.spansion.com
Spansion®, the Spansion logo, MirrorBit®, HyperBus, HyperFlash, HyperRAM and combinations thereof, are trademarks or registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
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