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PISMO(TM) Advisory Council Releases 2.0 Multimedia Specification | Cypress Semiconductor

PISMO(TM) Advisory Council Releases 2.0 Multimedia Specification

Last Updated: August 08, 2007

Enhanced interface support further streamlines system-level test and validation for chipset and memory vendors designing next-generation mobile and consumer products

SUNNYVALE, Calif., Aug 08, 2007 --

The PISMO(TM) Advisory Council, an industry organization focused on streamlining system-level memory validation and test, today announced ratification of the PISMO 2.0 Multimedia standard. The new multimedia extension for the existing PISMO2.0 specification addresses the growing need to store media-rich content in mobile and consumer products by bringing additional support for the MMC memory interface to chipset and memory vendors. The Council, founded by Spansion and ARM in 2004, now includes 15 member companies.

With the addition of MMC support, the PISMO Multimedia specification allows designers to test on development platforms a variety of memory devices, including NOR, NAND, DRAM (SDRAM), PSRAM, Double Data Rate (DDR), MMC and embedded MMC Flash memory, from multiple vendors.

"Over the last year, as semiconductor providers are seeking new ways to reduce design cost and complexity for system designers, the PISMO interface has seen a growing acceptance as the standard interface to use," said Richard Sah, chairman of the PISMO Advisory Council. "The PISMO 2.0 multimedia specification provides the capability to support code, data and computation memory interfaces to streamline system-level memory and test validation activities."

Significant growth in the wireless and embedded markets has given rise to hundreds of new processors, chipsets and memory types that must be tested for compatibility. Without a standard interface, system manufacturers have to design and implement a variety of device-specific development boards to ensure compatibility. The PISMO interface standard is intended to address this challenge.

Member Support of PISMO 2.0 Multimedia Specification

"Using the PISMO connectors on the ARM(R) RealView(R) Hardware Platforms offers an excellent way to validate ARM PrimeCell(R) memory controllers and develop software for memory devices from a range of manufacturers," said Mark Snook, IP Deployment marketing director at ARM. "By offering a standard low-cost route to add chipsets with a static memory interface such as Ethernet or USB to RealView Platform Baseboards, PISMO connectors increase the flexibility of our solutions."

The addition of status signals for NOR and NAND interfaces in the PISMO 2.0 multimedia specification provides added test and validation flexibility, as well as additional pins for chipset and memory vendors.

"Micron's Managed NAND products, which meet the eMMC standard, are fully compatible with the PISMO 2.0 specification and we're proud to continue our support with the new multimedia standard," said Jim Cooke, director of applications engineering for Micron. "Additionally, with support for the LOCK pin found in many low-voltage Flash devices as well as support for multiple READY/BUSY pins, these new specifications continue to simplify system-level testing and validation to speed prototyping of mobile products."

"PISMO 2.0 is enabling Spansion to work more closely with our important handset OEM and chipset customers to bring greater efficiencies to the design process and speed time-to-market of their latest handset solutions," said George Minassian vice president of strategic planning and systems engineering, Wireless Solutions Division at Spansion. "The PISMO2 Multimedia Specification is providing a standardized board-level interface for Spansion's MirrorBit(R) NOR, MirrorBit ORNAND(TM) and upcoming MirrorBit Eclipse(TM) solutions to support and scale from entry-level up to high-end phone segments, enabling our handset OEM and chipset customers to more quickly bring innovative solutions to market."

About the PISMO(TM) Advisory Council

The PISMO Advisory Council, spearheaded by Spansion and ARM, is the industry's first organization focused on streamlining system-level memory test and validation. The PISMO interface standard defines mechanical and electrical specifications for small form-factor memory modules. The PISMO modules are stackable and supported by tools that provide easy access to signals for performing in-depth analysis. These features and more make PISMO memory modules ideal for validating and prototyping many combinations of memories and processors on a single board.

PISMO Advisory Council member companies include ARM, Analog Devices, Broadcom, Cypress, Synplicity Hardware Platforms Group, Micron, NanoAmp Solutions, NEC Electronics, Qimonda, SanDisk, Samsung, SMedia, Spansion, Spreadtrum and Toshiba. For more information on PISMO products and membership, please visit the PISMO Advisory Council Web site at The updated spec will be posted at:

Spansion(R), the Spansion Logo, MirrorBit(R), MirrorBit(R) Eclipse(TM), ORNAND(TM), HD-SIM(TM), PISMO(TM) and the PISMO logo and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.