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Matrix Semiconductor to Accelerate Development of Three-Dimensional Integrated Circuits Using Cypress Semiconductor Corp's Silicon Valley Technology Center | Cypress Semiconductor

Matrix Semiconductor to Accelerate Development of Three-Dimensional Integrated Circuits Using Cypress Semiconductor Corp's Silicon Valley Technology Center

Last Updated: July 06, 2004

Matrix Semiconductor to Accelerate Development of Three-Dimensional Integrated Circuits Using Cypress Semiconductor Corp's Silicon Valley Technology Center

Matrix Uses SVTC, Cypress's Recently Announced R&D Facility, to Develop and Qualify New Manufacturing Processes for Commercial 3-D Integrated Circuits
Matrix PR

SANTA CLARA, Calif., July 6, 2004 ¾ Matrix Semiconductor, Inc. ¾ a developer of high-density, low-cost, three-dimensional semiconductors ¾ today announced that it has renewed a mutual agreement with Cypress Semiconductor Corp. for the continued development of its three-dimensional semiconductor technology.  Matrix will utilize Cypress's R&D services within its Silicon Valley Technology Center (SVTC) to develop and qualify advanced processes for manufacturing the next generation of Matrix(R) 3-D Memory (3DM). 

Matrix 3DM is an inexpensive, high-capacity, permanent, non-volatile memory and the first product based on Matrix's innovations.

"By leveraging Cypress's services as a strategic partner for Matrix's pilot manufacturing line, our company can place more resources toward research and development, building on the substantial intellectual property that Matrix already possesses in this field," said Dennis Segers, President and CEO of Matrix Semiconductor. 

Cypress will continue to dedicate R&D fab capacity and clean room space to Matrix's research and development efforts, as well as provide access to Cypress's full suite of services, including simulation software, manufacturing execution system, and yield and failure analysis tools. Cypress operates as a full-service development facility on Matrix's behalf, which includes managing all equipment maintenance, tool modification, and mask generation throughout the pilot manufacturing value chain. This business arrangement allows Matrix, which will retain complete ownership of all related intellectual property, to focus its resources on value-add product and technology engineering, as it develops successive generations of Matrix 3DM. Matrix uses Taiwan Semiconductor Manufacturing Corp. (TSMC) as its production-level manufacturing facility for Matrix 3DM.

"Cypress is excited about the potential of 3D manufacturing technologies to provide significant advances in the semiconductor industry," said Chris Seams, Executive VP of Technology and Manufacturing at Cypress. "Matrix uses Cypress's leading-edge, state-of-the-art R&D fab to develop its 3D circuits and to get its new products into volume manufacturing, faster and more cost efficiently. Cypress's relationship with Matrix Semiconductor serves as a model for other companies to use Cypress's Silicon Valley Technology Center to develop innovative semiconductor technologies and other related nanotechnologies in the microelectromechanical, photonics and life sciences area."

About Matrix Semiconductor

Founded in 1998, Matrix Semiconductor, Inc. (Santa Clara, Calif.) has developed the means to create three-dimensional semiconductors using standard manufacturing techniques and materials. By optimizing use of a semiconductor wafer's area - building "up" rather than "out" - Matrix's 3-D technology produces highly dense chips at much lower costs than existing technologies. Matrix's first product, Matrix(R) 3-D Memory (3DM), is a low cost, high density, non-volatile memory compatible with existing standards and targeted for use in millions of portable electronic devices. More information is available at http://www.matrixsemi.com.

About Cypress

Cypress Semiconductor Corporation (NYSE: CY) is Connecting From Last Mile to First Mile(TM) with high-performance solutions for personal, network access, enterprise, metro switch and core communications-system applications." Cypress Connects(TM) using wireless, wireline, digital and optical transmission standards, including USB, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at http://www.cypress.com.

Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation." "Connecting from Last Mile to First Mile" and "Cypress Connects" are trademarks of Cypress. All other trademarks are the property of their respective owners

Type: 
Corporate

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