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Thermal Characteristics of CY23S09 | Cypress Semiconductor

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Thermal Characteristics of CY23S09

Last Updated: December 07, 2011

What are the thermal resistance values for the CY23S09?


The thermal parameters for

CY23S09 are:

Maximum Junction Temperature is 150°C

CY23S09S (SOIC package)

Theta-Ja = 124 °C/W

Theta-Jc = 50 °C/W


CY23S09Z (TSSOP package)

Theta-Ja = 117 °C/W

Theta-Jc = 34 °C/W

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