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Pb-Free option of SRAMs

Last Updated: March 26, 2011

What are the differences in reflow/assembly process required by Pb-Free devices?



There are requirements and conditions for the Pb-Free devices reflow process and are tabulated in the Cypress Pb-Free reflow profile shown below. The product must meet two stringent requirements, zero lead and high temperature (260 ?C) reflow capability. Higher temperature reflow capability is needed because Pb-Free solder pastes melt at higher temperatures. The Pb-Free devices are marked with an 'X' on the package in the standard parts number.


For leadframe-based packages, Nickel Palladium Gold (Ni-Pd-Au) and Matte Tin (Sn) are the primary options. Nickel Palladium Gold (Ni-Pd-Au) for internally manufactured product and Tin (Sn) for subcontract manufactured products.


BGA packages will use Tin-Silver-Copper (SnAgCu) instead of Tin-Lead (SnPb) balls 


Cypress Semiconductor 260 Pb-Free Reflow Profile




Ramp Rate 217 ?C

3 ?C /sec max 

Preheat Temperature 150 ?C (+/-25?C)


60 to 120 seconds max 

Time 50 ?C to Peak Temperature 

3.5 minutes, 6 seconds max 

Temperature maintained above 217 ?C 

60 to 150 seconds 

Time within 5 ?C of actual peak


10 to 20 seconds 

Peak temp range

260 ?C (-5/+0) ?C 

Ramp-down rate 

6 ?C /second max

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