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Lead-Frame Plating Processes for ZDBs | Cypress Semiconductor

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Lead-Frame Plating Processes for ZDBs

Last Updated: June 23, 2011

What are the Lead-Frame Plating Processes for ZDBs?


Two options regarding lead-frame plating (to prevent corrosion, and act as a containment layer): Option #1: Lead-free plating. Because of the environmental dangers posed by using lead, Cypress offers a lead-free plating process consisting of Ni-Platinum-Gold and pure-tin RoHS 6/6. Option #2: Tin/Lead solder dipping plating process, consisting of 63% Tin (Sb), 37% Lead (Pb) for leaded devices RoHS (5/6).

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