You are here

Cypress Parts Baking Condition Information | Cypress Semiconductor

Support & Community

Cypress Parts Baking Condition Information

Last Updated: May 24, 2012

Do Cypress parts require baking? If so, what are the conditions?


Cypress products require baking before board mounting, if any of the following criteria are met:

  1. Humidity indicator card (HIC) is equal or greater than 10% when read at 23ºC +/- 5 ºC
  2. After removal from bag, parts are not mounted on board within 168 hours (in equal or less 30 ºC /60%RH)
  3. If they have not been stored in equal or less than 10% RH (as required on the MSL label)

If baking is required, devices may be baked for 24 hours at 125 ºC +5/-0 ºC.

Please note that the above baking condition is applicable for MSL-3 and MSL-5 parts only. Also, please ensure that only metal tubes or bakeable trays with rating of greater than 125 ºC must be used for baking. MSL 1 parts do not require baking.

Cypress recommends the customers to follow the Shelf Life condition of the parts as stipulated on the MSL label which can be found on the Moisture Barrier Bag (MBB) bag. A separate article on the Shelf Life of Cypress products is available at the following link:

Provide feedback on this article

Browse KB By Product

Browse KB by Type