CYP15G0403DXB BGA Pad Opening Details | Cypress Semiconductor
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CYP15G0403DXB BGA Pad Opening Details
Question: Does the CYP15G0403DXB-BGI 256-ball BGA package have Solder Mask Defined or Non-Solder Mask Defined openings?
Response: This package has Solder Mask Defined openings. The opening dimension is 0.61 +/-0.05mm. The ball pad metal nominal diameter is 0.76mm.