You are here

Alpha Mold Compounds Used for Cypress Products – KBA 89839 | Cypress Semiconductor

Support & Community

Alpha Mold Compounds Used for Cypress Products – KBA 89839

Last Updated: November 22, 2016
Version: 
*C
Question: 

Which low-alpha and non-low alpha mold compounds does Cypress Semiconductor use for its products?

Answer: 

The materials used for encapsulating semiconductor devices are known as plastic molding compounds. Molding compounds are generally composite materials consisting of epoxy resins, phenolic hardeners, silicas, catalysts, pigments, and mold release agents.

The following table lists the mold compounds used for Cypress products and specifies whether each is low-alpha mold compound material.

Mold Compound Material  Supplier

Mold Compound Material Name

Low-Alpha Mold Compound?

Sumitomo

G700

No

Hitachi

CEL 9220HF13

No

Sumitomo

EME-G770H

No

Hitachi

CEL9200THF

No

Sumitomo

G631

No

Sumitomo

G600

No

Kyocera

KE-G6000DA

Yes

Kyocera

KE-G3000DA

No

Kyocera

G2250

Yes

Kyocera

G2270

Yes

Kyocera

G1250LK

DS

Yes

Kyocera

G2250LK 

DS

Yes

Nitto

MP-8500 series

No

Sumitomo

6600H

No

Hitachi

CEL 9200CY-R

No

Hitachi

CEL 9200THF-U

Yes

Hitachi

CEL9200THF

No

Hitachi

CEL9200HF 

No

Nitto

7470-LA

No

Nitto

GE100LFCSV

Yes

Plaskon

CK-7000LA

Yes

Nitto

MP8000CH

No

Henkel

GR9810 –1PLA

Yes

Hitachi

CEL9240

No

Toshiba

G1270MC

No

Provide feedback on this article

Browse KB By Product

Browse KB by Type