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Joe Rauschmayer | Cypress Semiconductor


Joe Rauschmayer
Executive Vice President, Manufacturing


Joe Rauschmayer is the executive vice president of manufacturing for Cypress. He brings more than 32 years of expertise to the position. He was previously senior vice president of Spansion’s wafer fabrication operations and its corporate quality and product engineering functions, charged with leading the company’s internal and external wafer fabrication operations, bringing new products to market, managing product cost controls and ensuring product quality and reliability.


Prior to his last role at Spansion, he served as the company’s corporate vice president of engineering in the Wireless Solutions Division, responsible for product engineering, product development, test engineering and corporate test technology. Previously, he led the engineering team in the Consumer, Set-Top Box & Industrial Division, where he oversaw product engineering, product development, test engineering and system engineering. Prior to Spansion, Rauschmayer spent 14 years at AMD as part of the nonvolatile memory team, starting out in product engineering and holding roles as product line director and vice president of product line engineering for the Memory Group. At the Memory Group, he developed a systematic approach to yield enhancement that has been transferred to many of Spansion’s processes. Rauschmayer led efforts that drove AMD into the automotive flash marketplace, acting as the executive sponsor for the implementation phase of QS9000, the American Auto Industry Quality System Standard, which is now known as TS16949.

Rauschmayer has also served as senior vice president of operations and corporate officer of Sipex, an analog semiconductor company.

Rauschmayer holds a bachelor's degree in electrical engineering from Wilkes College and a master’s degree in electrical engineering from Ohio University.