Has anyone used FlashTemp User Module in their application? Can you provide me with the project?
Code snippet is provided in the "Flash temp" user module datasheet. You can refer that.
I'd like to encourage everybody to have a look at/into the datasheets wihich are imho very detailled and rather helpful. Yes, it takes some time to go through them but they are worth it!
Here is one ap note using it -
I did look at the datasheet and the code that Rajiv mentioned. However, I do believe that if anyone has ever used this User Module they would have implemented some calibrayion routine as the accuracy is very poor without that. If anyone has any project with some kind of calibration routine implemented, it would be very helpful for me if they can share the code.
This application note does mention that FlashTemp User Module can be used to implement temperature sensing but the project does not include it. This Application Note primarily talks about the Flash architecture in PSoC 1.
I am looking for a working project using FlashTemp along with calibration routine implemented. If anyone has implemented something similar in the past, it would be helpful if they could share the project else I will anyway create one myself.
The flashtemp was originally developed to measure the temperature of the dye when (before) flash gets programmed to adjust the timings. Due to that fact it will not measure the ambient temp which will differ from the dye's temp. The latter is related to the actual power dissipation which will change by the task that is actually run. Of course you may calibrate a linear curve Y=ax + b but this depends on measuring the actual chip temperature which is more difficult than calibrating an off-board sensor.
When you want to measure temp more exact I would suggest to read some of the application notes concerning Temp measurement for instance here http://www.cypress.com/?rID=63909
It might be possible to cal depending on the architecture of the sensor. If it
is BG related (0 K = 0 V) then you would only need one cal point. It measures die
temp, hence you would need to know application Pdiss and using thermal R of
package back into reading.
Another method would eliminate package and Pdiss if setup properly, see
picture. Basically at production test you implement a cal routine talking to
hi precision external instruments to accumulate a table of corrections. Seems
difficult, but done all the time for many products by test engineering departments.