Cap sense with PRoC BLE kit | Cypress Semiconductor
Cap sense with PRoC BLE kit
I have designed a 2 layer PCB for touch sense as per the directions given in the datasheet. Can someone verify the design and suggest any changes .I will be using a 2mm acrylic overlay on top of it. This PCB will connect to main board using a short 6x2 cable.
All the dimensions are in mm and the isolation between pads and ground is 1.8mm. I want to use the center larger pad for activating other pad scanning so in low power mode controller will be scanning only the center pad.