bonding consistency issues | Cypress Semiconductor
bonding consistency issues
I am running into an issue where the pairing/bonding process does not seem consistent/reliable. I am using CyBle - 2.30 with the security settings: mode 1, unauthenticated pairing with encryption, no input no output, bonding. The code is very similar to 100 days of code example day 15
I have several boards all 100% the same, same code, same IC (Cyble-022001-00). However, the bonding process works with my phones I am using for testing (3 iOS, 3 android). But when they go out to customers, several are un able to pair. Some customers are able to connect with one module, but not another. So the issue does not appear to be with varying phone models.
I am also having a secondary issue where some Android devices seem unable to pair. But that may be an Android issue...
Is anyone else seeing this inconsistency? Any thoughts/suggestions to improve reliability?