Any tips on soldering the PROC BLE Module? | Cypress Semiconductor
Any tips on soldering the PROC BLE Module?
I recently created out a prototype PCB for the PROC EZ-BLE module and I notice that the CY8CKIT-043 has an unpopulated footprint for this module. But I've not been able to summon the courage to actually attempt to solder one. Has anyone attempted this and if so could you offer any tips?
I have access to a hot-air rework station and some solder paste in a syringe. However whenever I've soldered packages with pitches this fine I've always ended up with a few solder bridges which I've had to rework with a solder wick. With two PCBs soldered face to face this will not be possible and it seems virtually certain I'd end up with some shorts or dry joints. Maybe it would help to put a small (heat resistant) spacer between the boards to give the solder a chance to collect on the pads under surface tension?