Application Notes - Cypress.com http://www.cypress.com/?app=search&searchType=advanced&keyword%3D%26rtID%3D76%26id%3D1936%26applicationID%3D0%26l%3D0 AN70630 - Event Data Recorder with Controller Area Network using PSoC® 3 and nvSRAM http://www.cypress.com/?rID=58300 Introduction

Systems that rely on electronic subsystems for their functionality use EDRs to store information about system status as it evolves after a critical event occurs. A critical event typically stops the system from functioning.

An EDR, such as the one described in this application note, monitors communication among electronic subsystems (controller area network nodes) and records all or selected information. Moreover, an EDR can store information collected and processed locally from various sensors.

The following table indicates the PSoC devices, PSoC Creator versions, compilers, and development kits that will work with this application note project:


Project
Device
PSoC Creator
Version
Development Kit
CY8CKIT-xxx
Compiler
Architecture
Silicon
Revision
V2.0
V2.1 SP1
V2.2
001
DVK
030/050
DVK
003/014
FTK
Keil
GCC
RVDS
MDK

AN70630.zip
Prod
YES
YES
NO*
YES
YES
NO
YES
N/A
N/A
N/A
Prod
NO
NO
NO
NO
NO
NO
N/A
NO
NO
NO
Prod
NO
NO
NO
NO
NO
NO
N/A
NO
NO
NO
*Note: This project is currently being updated for PSoC Creator 2.2 compatibility. A new version will be posted here by mid February, 2013.

Refer to Migrating CY8CKIT-001 DVK project to CY8CKIT 030/ 050.

The project associated with this application note can be downloaded from the ‘Related Files’ section below.

]]> Thu, 20 Dec 2012 23:51:49 -0600 AN4017 - Understanding Temperature Specifications: An Introduction http://www.cypress.com/?rID=12896 The following application note is intended to give the reader a basic understanding of the temperature specifications found in Cypress's product datasheets. There are many factors that affect the thermal operation of a device. This application note provides the reader with enough background to understand the thermal parameters and temperature specifications of the device.   

This document describes the various thermal parameters namely Ambient Temperature (Ta), Case Temperature (Tc), Junction Temperature(Tj), Thermal Resistance, Power Dissipation etc.

Details on calculating Junction Temperature are provided in this application note.

Clicking on the link below provides a tool which enables calculation of the I/O Switching Current (Iddq) for desired frequency, Total Power Consumption and Junction Temperature for Sync SRAMs

http://www.cypress.com/?docID=23984

Please refer to the respective product datasheets to get the Vdd voltage and Idd current used in the formula.

]]> Wed, 08 Aug 2012 23:16:56 -0600 Single Versus Multiple Transaction Translator - AN1071 http://www.cypress.com/?rID=47480 High-speed USB 2.0 hubs have a component to provide communication to full-speed and low-speed devices when the hub is operating at high-speed. This component is called a transaction tanslator (TT). The USB 2.0 specification allows two different implementations: one TT for all downstream ports (TT/hub) or one TT for each downstream port (TT/port). The TetraHub™ (CY7C65640B), which is a four-port high-speed hub, provides you with the option of using this part in a single TT (TT/Hub) or multiple TT (TT/Port) mode. This application note presents the differences and advantages of using multiple TT high-speed hubs versus a single TT high-speed hub. ]]> Thu, 28 Apr 2011 00:00:00 -0600