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Soldering Techniques for Gull Wing Packages Using Nickel-Palladium-Gold Finishes | Cypress Semiconductor

Soldering Techniques for Gull Wing Packages Using Nickel-Palladium-Gold Finishes

Last Updated: 
Nov 13, 2014
Version: 
*A

This white paper discusses soldering techniques for gull wing packages with nickel-palladium-gold (NiPdAu) finishes to achieve optimal solder joint wetting on the leads and the PCB pad.

A design of experiment using a TSOP 28 Cypress package with a NiPdAu finish was mounted on a customer PCB board to assess the influences of several variables during surface mount. The Pb-free solder paste used was tin-silvercopper (SnAgCu).