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SDIO: Bridging the gap of modular hardware design today | Cypress Semiconductor

SDIO: Bridging the gap of modular hardware design today

Last Updated: 
Dec 05, 2011

Modular hardware design is such a popular design practice today because of the improved time to market that it provides. Previously, handset design required the architecture to be planned, followed by schematics and the manufacture of an evaluation board that simulates the end product. This practice takes a lot of pre-study time before an evaluation board is made because a mistake or change in the specification will require a full re-manufacture of the board. This increases design time and cost. However, the modular hardware approach decreases the need for long planning cycles as expansion slots can be built on the evaluation board to accommodate changes in spec and feature sets. Designers now connect various modules to the core evaluation platform to achieve different desired results. With modular hardware design gaining traction, how are the various modules connected together?  To read more, click the download link below or visit

Mobile Handset DesignLine.