You are here

QTP 62504: <165-Ball Fine Pitch Ball Grid Array (FBGA) (13 x 15 x 1.4mm) (1.0mil wire) MSL3, 220C Solder Reflow CML-RA (Autoline) | Cypress Semiconductor

QTP 62504: <165-Ball Fine Pitch Ball Grid Array (FBGA) (13 x 15 x 1.4mm) (1.0mil wire) MSL3, 220C Solder Reflow CML-RA (Autoline)

Last Updated: 
Sep 20, 2016
Version: 
*A

QTP 62504