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QTP 50704: 165-Ball Fine Pitch Ball Grid Array (FBGA) (15 x 17 x 1.4mm and 13 x 15 x 1.4mm) MSL3, 260C Solder Reflow ASE-Taiwan (G) | Cypress Semiconductor

QTP 50704: 165-Ball Fine Pitch Ball Grid Array (FBGA) (15 x 17 x 1.4mm and 13 x 15 x 1.4mm) MSL3, 260C Solder Reflow ASE-Taiwan (G)

Last Updated: 
Aug 07, 2015
Version: 
*A

QTP 50704