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QTP 50702: 209-Ball Fine Pitch Ball Grid Array (FBGA) (14 x 22 x 1.76mm) MSL3, 220C Solder Reflow ASE-Taiwan (G) | Cypress Semiconductor

QTP 50702: 209-Ball Fine Pitch Ball Grid Array (FBGA) (14 x 22 x 1.76mm) MSL3, 220C Solder Reflow ASE-Taiwan (G)

Last Updated: 
Sep 20, 2016
Version: 
*A

QTP 50702