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QTP 31403: 48-ball Very Thin Fine Pitch Ball Grid Array (VFBGA) (6 x 8 x 1.0 mm) MSL3, 260C Solder Reflow ASE Taiwan (TAIWN-G) | Cypress Semiconductor

QTP 31403: 48-ball Very Thin Fine Pitch Ball Grid Array (VFBGA) (6 x 8 x 1.0 mm) MSL3, 260C Solder Reflow ASE Taiwan (TAIWN-G)

Last Updated: 
Aug 07, 2015
Version: 
*A

QTP 31403