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QTP 142004: 48 uFBGA (4.3 x 4.3 x0.60 mm) Cu-Pd Wirebond SAC105, MSL3, 260C Reflow G-Taiwan | Cypress Semiconductor

QTP 142004: 48 uFBGA (4.3 x 4.3 x0.60 mm) Cu-Pd Wirebond SAC105, MSL3, 260C Reflow G-Taiwan

Last Updated: 
Aug 07, 2015
Version: 
*A

QTP 142004