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QTP 123605: 84 UFBGA (6X6X0.6 mm) Cu-Pd Wirebond SAC105, MSL3, 260°C Reflow G-Taiwan | Cypress Semiconductor

QTP 123605: 84 UFBGA (6X6X0.6 mm) Cu-Pd Wirebond SAC105, MSL3, 260°C Reflow G-Taiwan

Last Updated: 
Aug 07, 2015
Version: 
*E