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QTP 123301: 209 FBGA (14X22X1.76mm) Multi-Die Package SAC405, Au Wire, MSL3, 260°C Reflow ASEK-Taiwan (G) | Cypress Semiconductor

QTP 123301: 209 FBGA (14X22X1.76mm) Multi-Die Package SAC405, Au Wire, MSL3, 260°C Reflow ASEK-Taiwan (G)

Last Updated: 
Aug 07, 2015
Version: 
*A