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7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly | Cypress Semiconductor

7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly

Last Updated: 
Feb 08, 2006
Version: 
1