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48/56-Lead SSOP (300mils) (limited to devices w/o downbonds), NiPdAu, MSL3, 260C Reflow, CML-R Assembly | Cypress Semiconductor

48/56-Lead SSOP (300mils) (limited to devices w/o downbonds), NiPdAu, MSL3, 260C Reflow, CML-R Assembly

Last Updated: 
Sep 20, 2006
Version: 
1