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48-56 Lead SSOP Package (11 mil Wafer Backgrind/300 mils) MSL1, 220c Reflow, CML-R Assembly | Cypress Semiconductor

48-56 Lead SSOP Package (11 mil Wafer Backgrind/300 mils) MSL1, 220c Reflow, CML-R Assembly

Last Updated: 
Jul 27, 2004
Version: 
1