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1.2mm Fine Pitch Ball Grid Array (FBGA) (7mils Backgrind Thickness), MSL3, 240C Solder Reflow | Cypress Semiconductor

1.2mm Fine Pitch Ball Grid Array (FBGA) (7mils Backgrind Thickness), MSL3, 240C Solder Reflow

Last Updated: 
Sep 10, 2004
Version: 
1