<64-Lead TSSOP (240mils), (devices without downbonds), NiPdAu, MSL3, 260C Reflow, Assembled at Amkor-Phil. | Cypress Semiconductor

<64-Lead TSSOP (240mils), (devices without downbonds), NiPdAu, MSL3, 260C Reflow, Assembled at Amkor-Phil.

Last Updated: 
May 19, 2006
Version: 
1